ASIC Packaging Engineer

Meta is looking for an experienced ASIC Packaging Engineer, Mechanical/Thermal modeling focus for its ASIC packaging team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team.

ASIC Packaging Engineer Responsibilities:

• As an ASIC Packaging Engineer, you will work with cross functional teams to define advanced package thermal/ mechanical specification for advanced packages 2.5d, 3D, wafer level packaging.
• Perform advanced package modeling for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging to ensure our ASICs meet/exceed performance and reliability targets
• Model and simulate package manufacturing and assembly process for advance packaging process chip on wafer on substrate (S/L/R), silicon interposer, HBM attach, package to board SMT process
• You will work with cross-functional teams from ASIC R&D and manufacturing to drive the mechanical/thermal design using advanced FEA of new ASICs, and make engineering trade offs with package warpage, stress, reliability, thermal performance
• Co-work with internal silicon, architecture and system teams and externally engaged partners, ASIC design partners, foundry and OSAT and substrate vendors
• Perform advanced package stress analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve package manufacturability and reliability for next generation versions of current products
• Packaging materials (e.g. underfill, mold compound, solder ball metallurgy, TIM, substrate, and lid attach adhesive) characterization to support new packaging architecture and develop material models to precisely describe package physical behavior
• Responsible for designing robust and reliable mechanical package architecture

Minimum Qualifications:

• Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.
• 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling
• Experience with complicated numerical simulation results against first principles such as strength of materials solutions
• Consider as an expert with hands-on experience of major FEM tools with skill to calibrate modeling and results with existing empirical data
• Hands of mechanical modeling stress analysis experience for interposer or fanout package design for both organic and inorganic interposer with or without bridges such as Cowos-L, cowos-R, EMIB, 3D IC structural concept and for lided or lidless package
• Proven fundamentals in the electrical/material/thermal or mechanical engineering field(s).
• Proven communication skills and experience working effectively with cross-functional teams

Preferred Qualifications:

• Master's or PhD degree in Materials engineering
• Experience and prior experience of taking products from concept to prototyping and production
• In-depth knowledge of modeling of flip chip, 2.5D and 3D and wafer packaging technologies package design
• Hands-on experience using FEM tools(e.g., ANSYS, ABAQUS, COMSOL etc.) in the creation of complex models,
• Programming experience using Matlab, Python and fundamental machine learning capability is plus

About Meta:

Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and WhatsApp further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today-beyond the constraints of screens, the limits of distance, and even the rules of physics.

Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment.

Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at [email protected].

$173,000/year to $249,000/year + bonus + equity + benefits

Individual compensation is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base hourly rate, monthly rate, or annual salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base compensation, Meta offers benefits. Learn more about benefits at Meta.