IBM Infrastructure has an opening for an entry level Signal and Power Integrity/Hardware Development Engineer. As a member of this elite team of engineering professionals you will develop solutions through high-speed serial channel analysis power domain analysis and 1st level chip packaging integration methodologies that enable hardware in IBM Mainframe and Quantum systems. Additionally members of this department partner with IBM Research on Custom Chip/Wafer Scale Integration and Quantum Cryogenic hardware development. Team members of this department impact IBM’s diverse product portfolio through involvement in high-level design support pre-production analysis lab validation and model-to-hardware correlation of early user hardware.
Qualified candidates will have excellent interpersonal communications critical thinking and problem-solving skills paired with introductory knowledge of Signal and Power Integrity and 1st Level Chip Packaging design processes. Additional recommended skills include experience with signal and power integrity software such as ANSYS and Cadence tools suites and PCB design software. A background in electrical engineering transmission line theory digital signal processing radio frequency design and packaging and PCB materials/processes is helpful.
- Perform strategic analysis on pre-production hardware designs utilizing commercially available and internally developed electromagnetic modelling tool suites scripting and transient simulation methodologies to validate and improve the performance of innovative high-performance high-quality future designs supporting IBM business goals focused on the Quantum brand.
- Develop and execute laboratory verification/characterization on early user hardware enabling model-to-hardware correlation to add value to future hardware designs.
- Collaborate with cross-site/cross-geo teams and leadership to establish and refine strategy for tackling aggressive product goals and schedules.
- Continuously innovating design and development processes with the department and utilizing Agile best practices.
- Bachelor’s degree in Engineering Computer Science or Physics
- Work experience in Microprocessor ASIC Signal and Power Integrity 1st Level Chip Packaging or Hardware Development environment
- Demonstrated experience in technical execution
- Demonstrated excellence in communication skills
- Eagerness to learn demonstrating a growth mindset
- Ability to proactively solve problems independently and in a team environment