Process Integration and Yield Engineer

Introduction
As a Hardware Developer at IBM you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.

Your Role and Responsibilities
We are seeking a chip process integration and hardware yield engineer who can work in a highly multi-disciplinary multi-cultural environment to work on Semiconductor and or Quantum applications at IBM Research. This candidate will be leading and supporting IBM research and development activities in semiconductor and/or superconducting circuit technology focusing on process development and yield improvement. This individual will work as a hardware developer to mature novel processes and integration schemes to build innovative structures that demonstrate the desired performance and yield benefits for IBM hardware technologies.

Responsibilities:

• Design and conduct experiments leveraging semiconductor process technology to optimize performance and yield.
• Track progress of hardware and analyze data to determine best conditions to optimize the process.
• Full ownership to identify issues and recommend solutions to improve performance and yield such as defectivity reduction.
• Design macros and circuits to evaluate various layouts.
• Create and protect Intellectual Property (IP).
• Create development routes actively maintain process controls and track process changes.
• Condense and present analyses and reports with a focus on effective technical communication.
• Identify and drive opportunities for operational and quality improvements.

  Work Locations: Albany NY and Yorktown Heights NY

Required Technical and Professional Expertise

• Ability to independently troubleshoot and solve complex problems
• Ability to communicate and work with a dynamic interdisciplinary team composed of electrical engineers fabrication engineers and experimental physicists
• At least 2 years experience in microelectronics materials and process integration chemistry or materials science research and/or applied physics research
• Demonstrated understanding of device physics of Superconducting Qubits
• In-depth knowledge of Process Integration of semiconductor devices
• Demonstrated understanding of Yield and Electrical Characterization

Preferred Technical and Professional Expertise

• Good understanding of Design and Electrical test setup
• Good understanding of defect Yield pareto build
• At least 5 years experience in microelectronics materials process integration and device characterization
• At least 3 years experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging
• Experience with fabrication processes for superconducting materials
• Understanding of Simulation/Emulation
• Strong presence and organization within team