As a Hardware Developer at IBM you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Overview:
Join IBM’s elite product development team driving innovation across IBM Z POWER Systems Storage and Quantum. We are seeking a skilled mechanical modeler with a strong background in simulation design and hardware validation to support high-performance and high-reliability server solutions.
Role Summary:
As a Mechanical Modeler you will design and optimize module and server hardware systems to meet stringent thermal and mechanical requirements. You’ll collaborate across disciplines to ensure designs meet performance reliability safety and manufacturability standards. This role involves simulation lab testing and providing actionable insights to guide engineering decisions.
Key Responsibilities:
- Develop and simulate system-level hardware models using CAD and FEA tools.
- Acquire or collaborate to obtain accurate material properties for modeling.
- Analyze qualification test data and validate against simulation results.
- Prepare detailed technical reports and presentations for stakeholders.
- Provide design guidelines for components such as laminates TIMs coolers chips GPUs HBMs and load actuation hardware.
- Influence design decisions to ensure robust packaging and system integration.
First-level packaging (chip laminate module) and module-to-socket integration
- Master’s/PhD in Mechanical Engineering.
- 3+ years of experience in Finite-Element Modeling (FEM).
- Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus).
- Ability to create scripts (APDL Python) beyond GUI modifications.
- Experience in design for manufacturability (DFM).
- Hands-on lab experience.
- Strong communication problem-solving and time management skills.
- Ability to work independently and in cross-functional teams.
- Familiarity with electronic packaging and heterogeneous integration.
- 5+ years in mechanical modeling.
- Experience in static structural FEA (stress strain warpage prediction).
- Moisture diffusion and swelling simulation expertise.
- Knowledge of server/computer architecture.
- Experience with lab tools: tensile testers (Instron/MTS) DMA TMA TGA.
- Applied statistics and DOE knowledge (Minitab JMP).
- Programming experience in Matlab Python LabView or C++.