Advanced Packaging Technologist

Introduction
As a Hardware Developer at IBM you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.

Your Role and Responsibilities
At IBM Research we invent things that matter to the world. We are a community of scientists engineers and designers creating the next advances in computing technology. It’s impossible to tell the story of computing without IBM. We are pioneering the most promising and disruptive technologies that will transform industries and society including the future of AI and Quantum Computing. With more than 3000 researchers in 12 labs located across six continents IBM Research is one of the world’s largest and most influential corporate research labs.

IBM’s Research Division is looking for an experienced Semiconductor Packaging Technologist to lead the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany New York. The candidate should possess deep knowledge in a wide areas of advanced packaging technology ranging from flip chip assembly Thermo-compression bonding hybrid bonding 2D 2.xD 2.5D 3D assembly laminate reliability and failure analysis among others. The candidate will technically lead a team of multi-disciplinary multi-cultural research and development engineers who will be working in the crossroads of advanced logic technologies nodes with next generation semiconductor packaging technologies. The position also requires interaction with crossfunctional and multi-company working teams that include engineers engaged in unit process development materials and process development structural/chemical/electrical analysis and layout design.

Required Technical and Professional Expertise

• 10+ years of experience in advanced packaging technology
• 5+ years of team lead experience
• 5+ years of experience working with packaging companies and OSATs Ability to drive joint development with tooling/material supplier ecosystem Possess a track record of innovation and technical eminence

Preferred Technical and Professional Expertise

• 15+ years of experience in advanced packaging technology
• 10+ years of team lead experience
• 5+ years of experience working with packaging companies and OSATs Prior experience in driving joint development with tooling/material supplier ecosystem Proven track record of innovation and technical eminence