Director, Business Intelligence and Analytics

Job Details:

Job Description:

About IFS:

As an integral part of Intel's new IDM 2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US- and European-based capacity to serve customers globally. IFS will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs.

IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. This business unit is completely dedicated to the success of its customers with full P& L responsibilities. This model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. IFS is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications.

About IFS Package Business Group: Packaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created in order to develop, grow, and execute a robust packaging roadmap.

Essential Duties and Responsibilities

• Understand portfolio of Intel advanced packaging technologies and competitor technologies. Apply data analytics and machine learning to provide competitive insights and provide recommendations for Intel packaging technology roadmap.
• Develop and maintain detailed pricing and cost analysis on package types, process flows, and customer product RFQs. Apply data science and analytics to provide faster RFQ response and more data driven cost and pricing recommendations.
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new packaging development and new product introduction and lead capacity and planning discussions.
• Perform feasibility analysis to design and develop data flow models for analytical reporting. This includes creating the baseline flow and frontend analytical reports which allows users the flexibility of slicing and dicing the Business data enabling multi-dimensional reporting.
• Provide methods for machine learning and data science on demand forecasting, capacity planning, and customer management.
• Work closely with manufacturing/engineering teams to develop and execute detailed risk assessments and mitigation plans for the manufacturability and reliability of NPIs to support customer requirements
• Work with advanced packaging development teams on the transfer of new packaging technologies to production qualification

Experience Required:

15 years of experience in the semiconductor industry.

8+ years of technical packaging experience in either manufacturing or development

5+ years in a customer facing role

Experience with flip chip BGA, 2.5D, and 3D packaging technologies

Qualifications:

Bachelor's Degree in related Engineering field (Mechanical, Chemical, Materials, Electrical engineering)

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, Austin

Business group:

Intel Foundry Services (IFS) is an independent foundry business that is established to meet our customers' unique product needs. With the first "Open System Foundry" model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient and sustainable source of supply.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in

US, California:$156,950.00-$274,730.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.