Manufacturing Technician

General Description:

Join a team in the fabrication of world class semiconductor based infrared focal plane arrays.

Required Skills:

Experience with hands-on processing of semiconductor devices, circuits, components and/or packaging are strongly desired. Familiarity with one or more of following processes is preferred: wafer or die bonding; die attach; underfill; wire bonding; non-destructive or destructive analysis such as wire pull, die shear test;

Experience with microscope, profilometry, and SEM inspection of wafers and die is a plus.

Depending on the existing skill set of the engineer, on the job training will be available for cleanroom practices, operating various semiconductor processing equipment, inspection techniques, MES understanding, metrology and data analysis skills.

Compensation:

The pay range for this position is $36.79 - $44.87 per hour + bonus + benefits.

Our ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.