Power Module Development Engineer

Job Summary

We presently have a job vacancy for a Power Module Development Engineer in our Research and Development Team located in our Fayetteville, AR technology center. This job opportunity is for an experienced Development Engineer with a thorough and detailed understanding of power module design, materials, assembly processes, and manufacturing.

What can Wolfspeed do for you?

• Opportunity to design and develop next generation power packaging technologies that can significantly impact a number of energy-related applications such as electric vehicles, wind, solar, and smart grid applications
• Ability to work on challenging multi-discipline engineering problems within a team environment as well as across other teams
• Opportunity to design and develop prototypes using state-of-the-art electronics packaging equipment that are transitioned to real world products and applications
• Further your professional career by on-site training, attending professional/engineering conferences, external certifications, and by working with the best of the best

What can you do for Wolfspeed?

• Interface with power electronics engineers, electrical engineers, mechanical engineers, process engineers, and production engineers to develop power module technologies that meet electrical, mechanical, reliability, and cost requirements
• Develop technologies for case and transfer-mold modules
• Assist with power module prototyping and assembly
• Assist in conducting experiments and acquiring data
• Perform thermal, mechanical, thermal-mechanical, and electrical simulations
• Must be excited to learn new skills, modeling techniques, and operate new equipment

What you need for success:

• Requires a 4-year degree and 5+ years of experience in industry, academia, or a federal research laboratory. Applicants with an M.S. or Ph.D. degree will also be given strong consideration
• 5+ years of experience in electronics CAD design and/or modeling
• Knowledge in industry standard and/or next generation assembly packaging processes such as wire bonding, die/substrate attach, vacuum reflow soldering, encapsulation, molding, plating, etc.
• Knowledge or experience working with common packaging materials such as solders, ceramics, silicone gel, epoxies, polymers, etc.
• Knowledge in Design of Experiments, 8D, and data analysis
• Some experience in technical project planning and leadership experience
• Excellent communication skills (i.e., verbal, written, and presentation)
• Excellent team player

Highly preferred skills and certifications:

• CAD experience: SolidWorks®, AutoCAD®, ProE, or Creo Parametric
• Simulation experience: COMSOL Multiphysics®, Ansys®, or SolidWorks® Simulation
• Knowledge in advanced packaging materials and interconnections: sinter, TLP, HT epoxies, HT gels, etc.
• Knowledge in advanced cooling: microfluidic channels, two-phase cooling, etc.
• Knowledge in electronics packaging test equipment: C-SAM, x-ray, pull tester, shear tester, etc.
• Understanding of "back of the envelope" thermal, electrical, and mechanical calculations and design optimization
• Experience with power packaging prototyping
• Packaging design or development experience using statistical analysis software such as JMP or Minitab
• Knowledge in power module reliability and failure modes
• Experience with FMEA documentation
• Experience with taking a design from concept to a qualified and reliable commercial product is desirable but not required
• Some knowledge of power devices such as SiC MOSFETs, SiC Schottky Diodes, SiC TMOS, Si IGBTs, etc.
• Experience working in a cleanroom environment (Class 1000 or better)

We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.