Job Description
Be an Early Applicant
San Jose CA USA
Hybrid
263K-355K Annually
Senior level
Artificial Intelligence • Internet of Things • Semiconductor
Build What the World Depends On
The Role
Develop and support methodologies for 3DIC and 2.5D physical design focusing on timing power thermal and multiphysics analysis with cross-team collaboration.
Summary Generated by Built In
We are seeking a CAD & Methodology Engineer to develop enable and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust scalable and production-ready flows spanning timing power IR/EM ESD thermal CFD/FEM and multiphysics analysis in close collaboration with physical design package PI reliability and EDA vendor teams.
The ideal candidate brings hands-on understanding of advanced-node implementation and signoff combined with strong scripting flow ownership and cross-team collaboration skills.
We are currently hiring across three locations: San Jose Austin and San Diego.
We are hiring at different levels (Principal Staff)
Responsibilities:
3DIC / 2.5D CAD Flow Development
Timing Power and Reliability Methodology
Thermal CFD and Multiphysics Methodology
Automation Infrastructure and Enablement
Teamwork and Vendor Engagement
Required Skills and Experience :
"Nice To Have" Skills and Experience :
Our 10x mindset guides how we engineer collaborate and grow. Understand what it means and how to reflect 10x in your work: https://careers.arm.com/en/10x-mindset
Salary Range:
$262700-$355400 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.
Accommodations at Arm
At Arm we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process please email [email protected] . To note by sending us the requested information you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list examples of support include breaks between interviews having documents read aloud or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.
Hybrid Working at Arm
Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace whilst recognizing the value of flexibility. Within that framework we empower groups/teams to determine their own hybrid working patterns depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases the flexibility we can offer is limited by local legal regulatory tax or other considerations and where this is the case we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.
Equal Opportunities at Arm
Arm is an equal opportunity employer committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals and don't discriminate on the basis of race color religion sex sexual orientation gender identity national origin disability or status as a protected veteran.
The ideal candidate brings hands-on understanding of advanced-node implementation and signoff combined with strong scripting flow ownership and cross-team collaboration skills.
We are currently hiring across three locations: San Jose Austin and San Diego.
We are hiring at different levels (Principal Staff)
Responsibilities:
3DIC / 2.5D CAD Flow Development
- Develop maintain and qualify CAD flows for 3DIC and 2.5D designs including chiplets interposers and advanced packaging technologies
- Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout
- Support die-to-die connectivity bump/TSV-aware flows and cross-die constraint management
- Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows
Timing Power and Reliability Methodology
- Develop and support STA methodologies for multi-die designs including cross-die timing constraints and closure strategies
- Enable power analysis IR drop and EM signoff flows for 2.5D and 3DIC systems
- Define guidelines for ESD verification in advanced packaging contexts
- Assist with tool qualification correlation and signoff criteria definition
Thermal CFD and Multiphysics Methodology
- Develop and support thermal analysis methodologies for 3DIC and 2.5D designs
- Enable CFD/FEM-based thermal analysis to model conduction convection and airflow effects from die to package to system
- Support coupled electro-thermal and Multiphysics flows integrating power thermal and reliability analysis
- Partner with design and package teams to incorporate thermal considerations early in the design flow
Automation Infrastructure and Enablement
- Build and maintain automation scripts and checks to improve flow robustness runtime and usability
- Develop documentation examples and training materials for design teams
- Debug flow issues and provide CAD support during active design cycles
- Drive continuous improvement based on user feedback and silicon takeaways
Teamwork and Vendor Engagement
- Work closely with physical design package PI reliability and silicon teams
- Collaborate with EDA vendors to evaluate new tools features and roadmap items
- Support tool upgrades regressions and flow migrations across projects
Required Skills and Experience :
- Minimum 5+ years of System Level experience
- Strong hands-on experience with 3DIC and/or 2.5D designs
- Familiarity with chiplet-based designs system-in-package designs and tradeoffs involved
"Nice To Have" Skills and Experience :
- Experience with TSVs micro-bumps interposers and advanced packaging technologies
- Familiarity with industry-standard EDA tools for 3DIC implementation and signoff
- Cadence Integrity 3D-IC
- Synopsys 3DIC Compiler
- Cadence Celsius Thermal Solver
- Ansys Icepak
- Ansys RHSC-ET
Our 10x mindset guides how we engineer collaborate and grow. Understand what it means and how to reflect 10x in your work: https://careers.arm.com/en/10x-mindset
Salary Range:
$262700-$355400 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.
Accommodations at Arm
At Arm we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process please email [email protected] . To note by sending us the requested information you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list examples of support include breaks between interviews having documents read aloud or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.
Hybrid Working at Arm
Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace whilst recognizing the value of flexibility. Within that framework we empower groups/teams to determine their own hybrid working patterns depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases the flexibility we can offer is limited by local legal regulatory tax or other considerations and where this is the case we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.
Equal Opportunities at Arm
Arm is an equal opportunity employer committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals and don't discriminate on the basis of race color religion sex sexual orientation gender identity national origin disability or status as a protected veteran.
Skills Required
- Minimum 5+ years of System Level experience
- Strong hands-on experience with 3DIC and/or 2.5D designs
- Familiarity with chiplet-based designs
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The Company
HQ: Cambridge England
8314 Employees
Year Founded: 1990
What We Do
We bring brilliant people together in a global ecosystem that is sparking the world’s potential. Arm technology enables specialized processing built on the economics design freedom and accessibility of general-purpose compute that has so far led to more than 180 billion chips being shipped by our partners.
Why Work With Us
At Arm we build the future of computing powering everything from smartphones to AI. Our 10x mindset drives bold thinking and deep collaboration to solve complex problems together. With a people first culture flexible work and strong support for growth and wellbeing your ideas can make a global impact while your career thrives.
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Date Posted
06/02/2026
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