Process Technician, Packaging & Assembly at Rigetti

Team: Fab Operations

Rigetti Computing is developing cloud-deployed quantum computers to solve humanity’s most pressing and valuable problems. We are a highly diverse and interdisciplinary team of scientists and engineers working at the cutting edge of technology in a mission-driven entrepreneurial environment. We believe that bringing together teams from various cultures, educational backgrounds, and technical disciplines helps them to see things from more points of view and to make great products that change the world for the better.

As Process Technician (Packaging & Assembly), you will be in charge of sustaining activities in the backend packaging process toward building quantum integrated circuits. You will spend your time immersed in the hands-on fabrication of these devices. You will work in a fast-paced environment with a wide range of engineers and scientists in process, integration, design, and quantum engineering.

This role is for an afternoon shift from 1:30pm - 10:00pm.

Key Responsibilities

Run day-to-day assembly & packaging activities, including: die-pick from wafer, visual inspection, plasma cleaning, flip-chip bonding, adhesive die-attach (manual), wire bonding (manual, semi-automatic, and automatic), wire-pull test, and relevant processes in a class 100 manufacturing cleanroom.

Activities will include equipment setup and recipes creation, operation, incoming and outgoing part inspection, part rework, and providing timely feedback to engineers for process and yield improvements

Follow standard operating procedure, packaging diagrams, and written work instructions

Utilize die map, die inspection report, and electrical-test results for die-pick from wafer. Will require consistent use of tweezers, ESD precautions, and microscope to support manufacturing operations and damage-free die handling

Identify any sample issues and highlight them

Perform detailed documentation after assembly & packaging operations

Responsible for equipment and process calibration and monitors (SPC)

Work seamlessly with morning shift’s assembly & packaging technicians with clear, consistent communication and structured shift handoff procedure

Work seamlessly with other fab team members in the afternoon shift, and be responsible as backup technician for other fab modules

Desired Skills

Associate or Bachelor’s degree in STEM related fields or 3+ years of relevant, hands-on semiconductor / MEMS fab experience

Hands-on experience using and operating a wide range of semiconductor/MEMS assembly and packaging tools, such as wire bonders, die-attach, epoxy dispense, flip-chip assembly, and relevant metrology tools

Hands-on experience in die-prep tools, such as wafer mount, and wafer die eject is a definite plus

Ability to operate and multi-task between multiple machines

Ability to use optical microscope 50% of your time – must have good hand-eye coordination and a steady hand

Comfortable working in a cleanroom environment, including hazmat handling protocols, and observing ESD practices

Experience in a small and/or large fab process environment

Comfortable operating in an agile, fast-paced small-company environment, with the flexibility to adjust work hours and workdays as needed

Detail-oriented, comfortable with computer-based recipe and wafer tracking systems

Strong planning abilities with excellent written and verbal communication skills

Comfortable with MS Office products, including Word, Excel, and PowerPoint, Google-docs

Process Technician, Packaging & Assembly

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