Semiconductor Engineering Position (Yorktown Heights, NY)

Introduction
At IBM work is more than a job – it’s a calling: To build. To design. To code. To consult. To think along with clients and sell. To make markets. To invent. To collaborate. Not just to do something better but to attempt things you’ve never thought possible. Are you ready to lead in this new era of technology and solve some of the world’s most challenging problems? If so lets talk.

Your Role and Responsibilities
The position is for a semiconductor process engineer with a focus on processes related to packaging bonding. The processing engineer will work with engineers and scientists on a wide variety of packaging bonding processes such as wafer-to-wafer and metal-to-metal bonding thermal compression bonding (TCB) inspection metrology and wet-dry cleans. The candidate will be a part of a team in the Microelectronics Research Laboratory (MRL) which provides world class 200mm wafer scale fabrication services to multiple clients including Quantum Computing Artificial Intelligence Center in Albany government programs as well as multiple Joint Development clients with projects in Health Care and Life science and the Internet of Things.

Required Technical and Professional Expertise

Familiarity with semiconductor processing and specifically bonding processes. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes and tools through inspection and metrology with a goal of tighter quality distribution higher efficiency (throughput improvements) and great yield.

Preferred Technical and Professional Expertise

Familiarity with wafer-to-wafer metal-to-metal bonding and thermal compression bonding (TCB) as well as debonding techniques. Great manual dexterity for manipulating smaller mechanical parts. Good organizational communication and presentation skills.