Semiconductor Engineering Position (Yorktown Heights, NY)

Introduction
At IBM work is more than a job – it’s a calling: To build. To design. To code. To consult. To think along with clients and sell. To make markets. To invent. To collaborate. Not just to do something better but to attempt things you’ve never thought possible. Are you ready to lead in this new era of technology and solve some of the world’s most challenging problems? If so lets talk.

Your Role and Responsibilities

The position is for a semiconductor process engineer with a focus on processes related to semiconductor packaging lithography. The processing engineer will work with engineers and scientists on a variety of packaging processes such as lithography wet cleans metrology and inspections. The candidate will be a part of a team in the Microelectronics Research Laboratory (MRL) which provides world class 200mm wafer scale fabrication services to multiple clients including Quantum Computing Artificial Intelligence Center in Albany government programs as well as multiple Joint Development clients with projects in Health Care and Life science and the Internet of Things.

Required Technical and Professional Expertise
Familiarity with MUV lithography wet processing techniques for patterning layers and silicon chip cleaning processes is important. Capability of learning new processes and semiconductor packaging tools quickly is also key. Driving improvements with processes and tools through inspection and metrology with a goal of tighter quality distribution higher efficiency (throughput improvements) and great yield.

Preferred Technical and Professional Expertise
Familiarity with specific silicon processing such MUV dry film lithography. Great manual dexterity for manipulating smaller mechanical parts. Good organizational communication and presentation skills.