Senior Digital Hardware Engineer

Department Description:

Cambium Networks develops Point to Multipoint and Point To Point RF solutions in both unlicensed and licensed bands. Customers include tier 2 and 3 telephony operators, wireless internet service providers, enterprises such as utilities, and federal, state, and local governments. Point to Multipoint technologies includes both proprietary Canopy and standards-based protocols.

Scope of Responsibilities/Expectations

A Senior Digital Hardware Engineer will be part of a world-class, highly motivated, highly skilled team of wireless system engineers who are committed to deliver carrier grade wireless equipment to customers in various verticals starting from WISP to Federal Governments. Candidate should be a firm believer of Cambiums mission, Connecting the Un-Connected and Under-Connected.

The candidate should have overall experience of 10+ years with most of this experience in Hardware Board Design, High Speed digital Interfaces and will be an individual contributor. He/She shall have the ability to

· Design, Develop and Test Digital Hardware sub system of Wireless Products.

· Should be able to create Schematic Design, BOM, and provide inputs to CAD layout teams.

· Work on the Board Bring up, DVT and work with contract manufacturers for Proto and production Builds.

· Work closely with Test labs for EMI/EMC Compliance and Regulatory Testing.

Specific Knowledge/Skills

· Must have strong knowledge of high-speed board design concepts including signal integrity theory and termination Strategies.

· Should have used these Interfaces in the Hardware Design- Ethernet (RGMII, SGMII, SGMII+, XFI, 5G, 10G), DDR3/4, NAND, SFP, SFP+, eMMC, NOR, SPI, I2C & UART, ESD and Surge Protection circuits.

· Should have worked on board bring-up.

· Experience in Power Supply Design (DC/DC, LDO, Isolated Flyback &Forward converter Designs, Non-Isolated Designs)

· Experience in designing POE Circuits (802.3af/at/bt compliant, Passive POE).

· Working Knowledge of FPGAs, pin planning, Power Budget Estimation.

· Should have worked on Processor based designs (Multi core, ARM, QorIQ).

· Should have experience in Electrical DVT of High-speed interfaces such as DDR3/4, PCIe Gen3/4, SGMII, XGMII, SERDES interfaces (capturing and analysing eye diagrams in oscilloscope).

· Should have experience in Thermal analysis and understanding of thermal behaviour and heat sinking of components in the PCBA.

· Experience in Design for EMI/EMC and proven experience in resolving EMI/EMC Issues.

· Experience in testing for Regulatory standards (CISPR22, UL Safety, IEC 61000-4-x, FCC Part 15b) for Telecom / Wireless products.

· Experience in schematic capture tools such as Cadence Design Entry, knowledge of Allegro PCB Design and Gerber viewing tools.

· Hand on Experience in using high speed Digital Scopes, Power Supplies, processor JTAG debuggers and other lab equipment.

· Should have experience in BOM Cost optimization and product sustainance.

· Excellent communication skills

· Experience working both independently and in a team-oriented, collaborative environment is essential.

Qualification

· B.Tech/M.Tech/M.E in Electrical communication or related field from reputed institutions. Master’s degree preferred.