Senior Packaging Engineer

We are looking for a Senior Packaging Engineer to lead the design, development, and characterization of our current and future trapped-ion package systems, which serve as the heart of IonQ’s quantum computers.  In this role, you will  work with a diverse team of electronic and optical packaging engineers, thermal and mechanical engineers, and FMEA engineers dedicated to this goal.  In addition, you will work closely with other quantum system leads, defining subsystem interfaces and exploring design-space constraints and tradeoffs to optimize full-quantum-computer-system performance.  

Responsibilities:

• Lead the mechanical design, development, and characterization of novel ion-trap-modules consisting of electrical and optical packaging techniques
• Coordinate the full packaging development lifecycle of novel hybrid optical and electronic systems; including detailed design, creation of statements of work for internal and external activities, procurement of components and materials, characterization, testing, and validation.
• Coordinate with other quantum system leads to define and explore subsystem interfaces and constraints
• Scope and set objectives for new technical projects centered on thermomechanical packaging analysis
• Drive the technical direction of projects and work hands-on in the lab to develop and implement creative technical solutions to challenging problems
• Develop project timelines, identifying key decision dates and completion dates
• Monitor project performance to understand impacts to cost, schedule, and technical performance; actively prioritize deliverables: determine critical path amongst cross-functional deliverables
• Conduct risk analysis and develop mitigation plans to ensure on-time release and delivery of project deliverables
• Assist with the transition from research and development to production, including development of first articles and technology demonstrations

You'd be a good fit with:

• Bachelors or higher in Engineering or relevant field/discipline
• 5+ years of hands-on electronics or optics device packaging experience, especially with systems which undergo thermal stress cycling
• 5+ years leading a high-precision R&D packaging development effort in industry
• Expertise using Solidworks
• Experience with FMEA
• Experience with thermal, electrical, and mechanical modeling of electronics packages in Ansys, COMSOL, or similar
• Expertise in identifying and using packaging techniques, components, and materials to manage mechanical stress and thermal expansion/contraction
• Understanding of cleanroom procedures
• Experience with data aggregation and statistical analysis/reporting
• Excellent communication skills and ability to work on and lead a team

You'd be a great fit with: 

• PhD in Engineering or relevant field/discipline
• Ultra-High Vacuum (UHV) device/component handling and knowledge of cryogenic and UHV-compatible materials
• Experience with micro-optics assembly and packaging
• SEM and profilometry experience
• Programming experience in MATLAB, Python, or other engineering relevant language
• Process development experience using Design of Experiments and Six Sigma methodologies