Senior Staff Engineer, Simulation

What You’ll Do

The SI / PI Simulation Engineer for semiconductor packaging will provide simulation results to analyze the design, consult concerning packaging problems and improvements in the package design, and also respond to customer / client requests or events at they occur.   Mission of the Packaging Solutions Center is to find package solutions beyond Silicon to make next performance systems considering power and cost and to tackle the difficult and hugely innovative task with the industry.

You will work very closely closely with customers from initial design concept to high volume manufacturing, with transparency, exceptionally flawless execution while delivering highest quality product. 

Location: Onsite at our San Jose headquarters 5 days a week with an average of 10% travel per month 

Reports to: VP of Packaging Development

Job #: 41190

• Responsible for the electrical design, analysis, and development of electronic packages.
• Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
• Focus on linear and non-linear response analysis and testing of microelectronic packages, devices, and enabling components, with focusing on automotive applications. Identify, assess, and/or develop the key analytical techniques.
• Analyze simulation and measurement results to enhance product reliability.
• Provide the electrical and physical design of high-speed serial interface systems working with platform architecture and PHY design teams.
• Provide electrical design and validation of package and PCB working with multi-functional teams.
• Provide SI and PI modeling, simulation, and characterization of the high-speed serial interface.
• Develop and execute test plans to validate signal and power integrity.
• Work with product engineering and system engineering to debug and improve product yield.
• Complete other responsibilities as assigned.

What You Bring

• Bachelors Degree in Electrical Engineering or related Physical Science with 15+ years of experience or Masters in Electrical Engineering or related Physical Science with 13+ Years of Industry Experience or PhD  in Electrical Engineering or related Physical Science with 10+ yrs of Industry Experience Preferred.
• Experience in SI/PI methodology development, PDN modeling, and analysis from System to Die.
• Experience and good knowledge in EM (HFSS, SIwave, PowerSI, etc) and Circuit Simulation (SPICE, ADS, Designer) tools.
• Understanding of High-speed parallel IP (LPDDR5/DDR5/GDDR6) timing budget, Jitter Analysis, Full-Channel Simulation
• Understanding of High-speed SerDes Channel simulation and Equalization.
• Understanding of the Chiplet Interface and System-level Power Delivery Architecture.
• Good knowledge of SI, and PI Measurements such as VNA, TDR, and Digital Oscilloscope analyzer.
• Experience with script languages such as python and Perl.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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