Advanced Packaging and Integration Engineer

Essential Duties:

Contribute to the innovation and development of 2.5D & 3D semiconductor integration processes for RF and high-speed mixed-signal electronics applications

Focus on key areas such as RF electrical performance of components, thermal-mechanical constraints, manufacturability, and cost considerations

Support integration efforts from chip-level to package and PCB

Conduct analyses of potential approaches under guidance

Collaborate with technical teams across various domains

Participate in research and development projects, contributing to technical organization and reporting

Help build relationships with vendors and partner organizations

Contribute to the preparation of reports, journal papers, and presentations

Support the creation of work plans to meet project timelines and objectives

Required Skills:

Recent experience or coursework in semiconductor manufacturing processes and electronics packaging

Familiarity with design of experiments and analysis techniques related to electrical, mechanical, thermal, and chemical properties.

Ability to contribute to building vendor relationships and external partnerships

Some experience or coursework in organizing and contributing to research and development efforts, including presentations and proposals

Basic understanding of commercial packaging technology (e.g., ceramic, laminate chip-level packages, printed circuit boards) and integrated circuit processing techniques

Familiarity with material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques

Exposure to high-speed electrical characterization methods is a plus.

Proficiency in Microsoft Office tools (Word, Excel, PowerPoint) and ability to write clear reports.

Ability to work in a fast-paced, deadline-driven environment, both independently and as part of a team

Required Education:

B.S. degree in Electrical Engineering, Mechanical Engineering, Physics, or a related scientific discipline

M.S. preferred

Physical Requirements:

Comfortable using computers and engineering workstations and interacting with colleagues and vendors

Must be able to work in confined spaces and have good visual and hearing acuity

Special Requirements: 

Current U.S. person status required

Ability to obtain and maintain a US government security clearance is desired. 

Compensation:

The base salary range for this full-time position $76,530 - $93,320 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.