Advanced Packaging Manager

Introduction
As a Hardware Developer at IBM you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.

Your Role and Responsibilities
At IBM Research we invent things that matter to the world. We are a community of scientists engineers and designers creating the next advances in computing technology. It’s impossible to tell the story of computing without IBM. We are pioneering the most promising and disruptive technologies that will transform industries and society including the future of AI and Quantum Computing. With more than 3000 researchers in 12 labs located across six continents IBM Research is one of the world’s largest and most influential corporate research labs.

IBM’s Research Division is looking for an experienced Semiconductor Packaging Manager to lead the chiplet and advanced packaging initiatives for IBM Semiconductors in Albany New York. Candidate should have strong leadership skills and background in leading large teams on technical projects both hands on and as a leader. The candidate should also possess deep knowledge in a wide areas of advanced packaging technology ranging from flip chip assembly Thermo-compression bonding hybrid bonding 2D 2.xD 2.5D 3D assembly laminate reliability and failure analysis among others. The candidate will lead a team of multi-disciplinary multi-cultural research and development engineers who will be working in the crossroads of advanced logic technologies nodes with next generation semiconductor packaging technologies. The position also requires interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development materials and process development structural/chemical/electrical analysis and layout design

Required Technical and Professional Expertise

• 10+ years of experience in managing teams in the area of advanced packaging technology
• 5+ years of technical experience in advanced packaging
• 5+ years of experience working with packaging companies and OSATs Ability to lead teams in joint development and novel process innovation with tooling/material supplier ecosystem Possess a track record of innovation technical and management eminence

Preferred Technical and Professional Expertise

• 10+ years of experience in managing teams in the area of advanced packaging technology
• 10+ years of technical experience in advanced packaging
• 5+ years of experience working with packaging companies and OSATs Prior experience in leading teams in joint development and novel process innovation with tooling/material supplier ecosystem Proven track record of innovation technical and management eminence