Principal Firmware Architect

Microsoft · Redmond

Company

Microsoft

Location

Redmond

Type

Full Time

Job Description

The Microsoft Silicon Engineering Solutions and Cloud Hardware Infrastructure Engineering (SCHIE) team is responsible for developing and delivering the hardware and firmware that is responsible for powering Microsoft's "Intelligent Cloud" mission. S CHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Skype, OneDrive and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

Are you passionate about working on cutting edge new technology in a team that embodies the growth mindset? Are you hoping to join an organization which is built on a mission "To empower every person and organization on this planet to achieve more"?

The Firmware Center of Excellence is responsible for hardware/firmware for Azure Infrastructure. We are working on the next generation hardware/firmware for server, silicon and rack infrastructure with a focus on innovation in firmware technology to secure Azure infrastructure for Microsoft and their customers.

We are looking for a highly motivated Principal Firmware Architect with a background in firmware architecture to work on lighting up these various technologies as each team produces their part. You must have experience with System-on-Chip (SoC) Architecture and Design, bring up of SoC, root causing issues at the intersection of multiple subsystems across firmware and hardware.

Qualifications:

Required Qualifications:
  • 12+ years of technical engineering experience
    • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 10+ years of technical engineering experience
    • OR Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 7+ years of technical engineering experience
    • OR Doctorate degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years of technical engineering experience.
  • 10+ years of professional experience designing, developing Embedded Software solutions .
  • Experience with working from early concept of SoC Architecture and design to shipping final product .
  • Experience driving firmware architecture solutions with detailed troubleshooting and debugging skills .
Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Preferred Qualifications:
  • The successful candidate should have experience with some or all the following: Peripherals such as PCIe, memory interfaces, OS primitives, memory management, scheduling, interrupts, threading.
  • Experience with Implementation of Hardware/Firmware Security primitives.
  • Experience with Platform initialization, Board support package integration, low level drivers for peripherals such as PCIe, I2C, eMMC, SPI, USB, UARTs as well as Memory Management, Scheduling, Interrupts and multi-threading .
  • Experience with Architecting, Designing and delivering on new Data Center class technologies across the entire platform.
Hardware Engineering IC6 - The typical base pay range for this role across the U.S. is USD $158,500 - $276,600 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $202,800 - $304,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form .

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

#azurehwjobs

Responsibilities:

  • You will be involved with all phases of product development, from microarchitecture design through firmware architecture and development.
  • At the design phase, you will be part of a team driving the architecture, design and development of the various sub-systems including firmware development of low-level hardware interfaces and define flows for boot flows of ASIC.
  • You will be responsible for firmware level debug as part of end to end firmware development and debug.

Date Posted

08/13/2023

Views

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